I am simply planning to make a solder stencil
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<br />On , jeanmarc.leblanc@gmail.com wrote:
<br />> can you elaborate on the bump mask? I am curious. a quick google did not reveal any thing.
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<br />> I am simply experimenting of a cheap way to solder these LGA chips
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<br />> I forgot to cc the lab
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<br />> (igoogle does not have a reply all)
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<br />> On , Michael Ayukawa mike.ayukawa@gmail.com> wrote:
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<br />> That is good stuff. Were you planning on using it as an etch mask?
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<br />> Or are you thinking something completely different? People usually use Kapton if they
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<br />> plan to retain it as a dielectric layer in the stack. So perhaps you are using this for
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<br />> what would be called a "bump mask"?
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<br />> You really don't need the high temp properties for wet chemical processes.
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<br />> The interface to the Cu is probably more important (etchant can quickly move along the
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<br />> interface). We used to use special adhesion promoters and bakes to avoid
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<br />> jeanmarc.leblanc@gmail.com wrote:
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<br />> I was going to buy this
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<br />> http://www.ebay.ca/itm/Kapton-Polyimide-100TAB-E-8-x12-3-Sheets-Free-S-H-/370109637919?pt=LH_DefaultDomain_0&hash=item562c40e51f
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<br />> From what I read, that is the metrial that is recommended for this kind of thing and cuts well with lasers